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Venture Clienting with ebm-papst – Shape the Future of Chip Cooling

ebm papst is looking for partners to co-develop next-generation chip cooling solutions that set new benchmarks in thermal performance and energy efficiency for AI workloads. Selected innovators get access to engineering expertise and lab environments — enabling rapid PoCs and a clear path toward scalable venture clienting partnerships.

Who can participate?

All innovators working on advanced chip cooling systems with a functional or testable solution — including startups, scaleups, established technology companies, research teams, and independent engineering groups.
If your cooling concept uses a liquid cooling medium and targets high-performance computing or AI data centers, it is in scope.

#ChipCooling#VentureClienting#DeepTech#InnovateTogether

Process 

ebm papst follows a structured Venture Client process to evaluate, compare and pilot different solution approaches.

1. Application via Platform

Solution providers submit their application through the ekipa platform until the deadline.

2. Get-to-Know Conversations

Short digital sessions (30–45 minutes) with selected providers to:

  • clarify open questions
  • understand your cooling concept, current maturity and reference deployments
  • discuss technical integration with advanced liquid cooling components and available performance data
  • outline a first PoC idea (lab setup, roles, timeline) and discuss expected value and early assumptionsThis step ensures both sides know what a collaboration could look like.

3. Kick-Off Workshop & Scoping

Selected providers join an on-site or virtual workshop to:

  • align on success criteria (technical, commercial, and data-related)
  • define the cooling concept’s operating envelope together with ebm papst (temperatures, pressures, flow ranges, fluid type, cleanliness levels)
  • specify the integration of an advanced liquid cooling components into the cooling loop, including interfaces, sensors and required lab setups
  • clarify responsibilities, milestones and expected deliverables on both sides
  • finalize the PoC and testing scope, timeline, setup and potential costs.

The outcome is a clear joint plan for the PoC.

4. Boost Phase

The Proof-of-concept (PoC) should focus on:

  • validating cooling performance and stability of your solution together with advanced liquid cooling components under real or simulated data-center conditions
  • refining the operating envelope (temperature ranges, pressures, flow rates, cleanliness levels) and confirming the most relevant duty points for future chip cooling components
  • collecting structured measurement data (for example temperatures, pressures, flow, energy consumption) to further populate and sharpen the ebm papst evaluation matrix
  • testing integration, control and operation of the joint setup, including start-up behaviour, dynamic load changes and typical service/maintenance procedures
  • deriving first business insights such as expected efficiency gains, retrofit potential and indicative component volumes for different cooling concepts and customer segments

5. Rollout Evaluation & Next Steps

Based on PoC performance, ebm papst decides on:

  • extension of the PoC
  • possible co-development steps
  • commercial model and scaling roadmap