Submissions closedVenture Clienting with ebm-papst – Shape the Future of Chip Cooling
ebm papst is looking for partners to co-develop next-generation chip cooling solutions that set new benchmarks in thermal performance and energy efficiency for AI workloads. Selected innovators get access to engineering expertise and lab environments — enabling rapid PoCs and a clear path toward scalable venture clienting partnerships.
Who can participate?
All innovators working on advanced chip cooling systems with a functional or testable solution — including startups, scaleups, established technology companies, research teams, and independent engineering groups.
If your cooling concept uses a liquid cooling medium and targets high-performance computing or AI data centers, it is in scope.
How to submit
Process
To participate solution providers, submit two elements via the ekipa platform:
1. Fixed Questions (online form)
After joining the challenge, applicants complete a short set of mandatory questions. These questions ensure comparability across all submissions and allow ebm papst to assess solution fit quickly and fairly.
2. Pitch Deck (PDF upload)
Applicants upload a concise pitch deck providing additional depth.
The deck may include:
- product overview & key features
- architecture / technical setup
- reference customers or pilots
- differentiation vs. competitors
- pilot idea for ebm papst (initial thoughts, assumptions, integration concept)
- expected benefits and value contribution
- commercial model and pricing structure
The pitch deck should allow ebm papst to understand the solution in context and evaluate its potential for a joint PoC project.