Venture Clienting with ebm-papst – Shape the Future of Chip Cooling

ebm papst is looking for partners to co-develop next-generation chip cooling solutions that set new benchmarks in thermal performance and energy efficiency for AI workloads. Selected innovators get access to engineering expertise and lab environments — enabling rapid PoCs and a clear path toward scalable venture clienting partnerships.

Who can participate?

All innovators working on advanced chip cooling systems with a functional or testable solution — including startups, scaleups, established technology companies, research teams, and independent engineering groups.
If your cooling concept uses a liquid cooling medium and targets high-performance computing or AI data centers, it is in scope.