ekipa - Venture Clienting with ebm papst – Shape the Future of Chip Cooling

ebm papst is looking for partners to co-develop next-generation chip cooling solutions that set new benchmarks in thermal performance and energy efficiency for AI workloads. Selected innovators get access to engineering expertise and lab environments — enabling rapid PoCs and a clear path toward scalable venture clienting partnerships.

Who can participate?

All innovators working on advanced chip cooling systems with a functional or testable solution — including startups, scaleups, established technology companies, research teams, and independent engineering groups.
If your cooling concept uses a liquid cooling medium and targets high-performance computing or AI data centers, it is in scope.

#ChipCooling #VentureClienting #DeepTech #InnovateTogether

Executive Summary

Challenge in one sentence

Identify and showcase high-performance chip cooling solutions that, together with ebm papst advanced liquid cooling components, set new benchmarks for efficient and scalable AI cooling.

Why This Matters

AI and high-performance computing are pushing heat loads in data centers to new extremes. Next-generation cooling concepts are emerging fast – but there is still no clear set of reference solutions that combine innovative cooling technologies with industrial-grade heating and cooling equipment to maximize performance and energy efficiency.

Solution Space

We are looking for advanced chip cooling solutions (e.g. direct-to-chip, immersion, hybrid or other liquid cooling concepts) that already work in practice or are validated in lab environments. If your system can be measured, compared on key metrics (cooling power, cost per watt, efficiency, space needs) and benefits from an optimized liquid cooling components, it is in scope.

Why Participate

This project offers innovators the chance to build and validate a joint cooling solution with ebm papst:

Access to technology and engineering expertise in flow, fluids and cooling systems
Opportunity to create a joint lab demonstrator or PoC under realistic operating conditions
Data-driven positioning of your solution in a structured comparison of leading cooling concepts
Direct path to venture-client partnerships, co-developed products or co-branded solutions for AI and data-center customers

Process

The participation process is structured to provide fast clarity and fair evaluation:

Application – Submit your application answering key questions about your cooling solution, maturity and expected value.
Evaluation & Shortlisting – Assessment based on problem fit, technical/data feasibility and impact potential.
Get-to-Know Session – Short digital session with the ebm papst team to align on use case, integration options and a first PoC idea.
Proof of Concept (PoC) – Joint PoC or lab demonstrator combining your cooling solution with advanced liquid cooling components emulation.
Next Steps & Scale-Up – Successful solutions are considered for further collaboration, customer pilots and long-term venture-client partnerships.